MR8 Motherboard CPU NAND Fingerprint Repair PCB Holder Fixture for i Phone 8P /8/7 P/ 7 / 6S Multi-Function Explosion-Proof
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Product details
| Management number | 220686840 | Release Date | 2026/05/03 | List Price | US$31.87 | Model Number | 220686840 | ||
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- 1. Motherboard PCB fixture, CPU NAND PCIE glue remove, fingerprint repair fxture Multi-Function in one.
- 2. Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board.
- 3. PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.
- 4. PCB repair platform designed with integrated layer tin planting function.
- 5. PCB repair platform added motherboard layer separation and positioning installation structure.
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